SW Reducing EUV Exposure Dose Through Underlayer Engineering
Posted: Sun Aug 23, 2026 9:00 pm
Extreme-ultraviolet lithography is essential for manufacturing advanced semiconductor devices, but its continued scaling presents a difficult materials problem. Photoresists must simultaneously provide high resolution, low exposure dose, limited line-edge or linewidth roughness, and extremely low defectivity. … Read More The post Reducing EUV Exposure Dose Through Underlayer Engineering appeared first on SemiWiki.
Source: https://semiwiki.com/lithography/372293 ... gineering/
Source: https://semiwiki.com/lithography/372293 ... gineering/