SCT Infineon sampling H-DPAK addition to top-side-cooling package family
Posted: Fri Jun 26, 2026 1:23 pm
With power conversion architectures in automotive and industrial applications evolving rapidly (placing new demands on switching topologies, thermal management, and system integration), Infineon Technologies AG of Munich, Germany has made available samples of the H-DPAK, a new addition to its top-side-cooling package family, housing integrated half-bridge (HB) devices in 750V CoolSiC G2 technology...
Source: https://www.semiconductor-today.com/new ... 0626.shtml
Source: https://www.semiconductor-today.com/new ... 0626.shtml