Discrete device designer and manufacturer Nexperia B.V. of Nijmegen, the Netherlands (which operates wafer fabs in Hamburg, Germany, and Hazel Grove Manchester, UK) has released 1200V silicon carbide (SiC) MOSFETs in QDPAK packaging, extending its growing wide-bandgap (WBG) portfolio with a top-side-cooled surface-mount package optimized for high-power-density and thermally demanding applications...
Source: https://www.semiconductor-today.com/new ... 0626.shtml