SCT ROHM launches new top-side-cooling package for SiC MOSFETs
Posted: Wed Jun 10, 2026 7:38 am
ROHM has developed the TSC3PAK (14.00mm x 18.58mm x 3.50mm) package for silicon carbide (SiC) MOSFETs. Mass production began in June...
Source: https://www.semiconductor-today.com/new ... 0626.shtml
Source: https://www.semiconductor-today.com/new ... 0626.shtml