SCT ROHM launches new top-side-cooling package for SiC MOSFETs

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SCT ROHM launches new top-side-cooling package for SiC MOSFETs

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ROHM has developed the TSC3PAK (14.00mm x 18.58mm x 3.50mm) package for silicon carbide (SiC) MOSFETs. Mass production began in June...

Source: https://www.semiconductor-today.com/new ... 0626.shtml
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