To deliver solutions for next-generation artificial intelligence (AI) systems, a strategic collaboration has been announced that will leverage the RISC-V design expertise of smart digital system specialist CEA-List and the silicon photonics expertise of micro/nanotechnology R&D center CEA-Leti of Grenoble, France to introduce high-bandwidth communication and high-efficiency computing technologies into the established 3D stacking and interposer platforms of Taiwanese foundry Powerchip Semiconductor Manufacturing Corp (PSMC)...
Source: https://www.semiconductor-today.com/new ... 0426.shtml