At the Mobile World Congress (MWC 2026) in Barcelona, Spain (2–5 March), engineered substrate manufacturer Soitec of Bernin, near Grenoble, France and Nanyang Technological University, Singapore (NTU Singapore) are announcing results of their joint four-year research program into next-generation 6G connectivity. As 5G adoption becomes widespread and consumers are becoming accustomed to the speed and bandwidth it offers, Soitec and its research partners are laying the groundwork for the next revolution in wireless communication...
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