The demand for higher power densities in increasingly space-constrained environments continues to grow, whether in on-board chargers for electric vehicles or power supplies for AI data centers. At the recent PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 June), Munich-based Infineon Technologies AG hence introduced EasyPACK S, a compact power module and packaging concept specifically designed to meet these requirements. With a package height of only 5.6mm and a footprint of about 33mm x 36mm, EasyPACK S is said to enable significant system miniaturization while ensuring reliable thermal performance and reduced electromagnetic interference. The first modules available in the new package integrate Infineon’s CoolSiC MOSFETs 1200V G2 as well as IGBT4 and IGBT7 1200V technology...
Source: https://www.semiconductor-today.com/new ... 0626.shtml