With power conversion architectures in automotive and industrial applications evolving rapidly (placing new demands on switching topologies, thermal management, and system integration), Infineon Technologies AG of Munich, Germany has made available samples of the H-DPAK, a new addition to its top-side-cooling package family, housing integrated half-bridge (HB) devices in 750V CoolSiC G2 technology...
Source: https://www.semiconductor-today.com/new ... 0626.shtml