Discrete device designer and manufacturer Nexperia B.V. of Nijmegen, the Netherlands (which operates wafer fabs in Hamburg, Germany, and Hazel Grove Manchester, UK) and power electronics firm Semikron Danfoss GmbH of Nuremberg, Germany have signed a memorandum of understanding (MoU) to explore a strategic collaboration on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The collaboration aims to combine Nexperia’s expertise in SiC semiconductor technology with Semikron Danfoss’ capabilities in power module packaging and integration. Together, the firms intend to evaluate how a joint approach can enable high-performance, scalable solutions for next-generation electric vehicles...
Source: https://www.semiconductor-today.com/new ... 0626.shtml